A research team from Pohang University of Science and Technology (POSTECH), led by Professor Seok Kim, has introduced a revolutionary dry adhesive technology that enables precise, residue-free attachment and detachment of micro-LEDs and various everyday materials by utilizing shape memory polymers (SMPs) embedded with densely packed nanotips.
This design addresses the long-standing adhesion paradox, where theoretically strong adhesion contrasts with practical limitations such as surface roughness. At room temperature, the adhesive remains non-sticky; when heated and pressed, it smooths out to create strong adhesion, reverting when reheated. This enables over 15 atmospheres of bonding strength and a 1,000-fold switch in adhesion performance, without using liquid adhesives or films.
The team demonstrated high-precision pick-and-place of micro-LED chips with robotic systems and effective adhesion on varied materials like paper and fabric. The technology holds significant promise for smart manufacturing, display assembly, and flexible electronics, offering a clean, reusable alternative to conventional adhesives.
